Fast Contour Integral Equation Method for Wideband Power Integrity Analysis
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Year
: 2014DOI: 10.1109/TCPMT.2014.2327242
Keyword(s): Hankel matrices,electronics packaging,integral equations,interpolation,Hankel function interpolation,a posteriori approach,a priori approach,acceleration technique,automatic band split algorithm,complex package structures,electronic packages,fast CIE method,fast contour integral equation method,fast matrix filling,fast wideband simulation,power ground planes,system-level power integrity analysis,vector-fitting-based adaptive frequency sampling,wideband power integrity analysis
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Fast Contour Integral Equation Method for Wideband Power Integrity Analysis
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| contributor author | Huapeng Zhao | |
| contributor author | En-Xiao Liu | |
| contributor author | Jun Hu | |
| contributor author | Er-Ping Li | |
| date accessioned | 2020-03-13T00:09:25Z | |
| date available | 2020-03-13T00:09:25Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6837426.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1136432 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Fast Contour Integral Equation Method for Wideband Power Integrity Analysis | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8318122 | |
| subject keywords | Hankel matrices | |
| subject keywords | electronics packaging | |
| subject keywords | integral equations | |
| subject keywords | interpolation | |
| subject keywords | Hankel function interpolation | |
| subject keywords | a posteriori approach | |
| subject keywords | a priori approach | |
| subject keywords | acceleration technique | |
| subject keywords | automatic band split algorithm | |
| subject keywords | complex package structures | |
| subject keywords | electronic packages | |
| subject keywords | fast CIE method | |
| subject keywords | fast contour integral equation method | |
| subject keywords | fast matrix filling | |
| subject keywords | fast wideband simulation | |
| subject keywords | power ground planes | |
| subject keywords | system-level power integrity analysis | |
| subject keywords | vector-fitting-based adaptive frequency sampling | |
| subject keywords | wideband power integrity analysis | |
| identifier doi | 10.1109/TCPMT.2014.2327242 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 8 | |
| filesize | 1626974 | |
| citations | 0 |