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Analysis and Design of a Novel Low-Loss Hollow Substrate Integrated Waveguide

contributor authorLukui Jin
contributor authorLee, Razak Mohd Ali
contributor authorRobertson, Ian
date accessioned2020-03-13T00:09:06Z
date available2020-03-13T00:09:06Z
date issued2014
identifier issn0018-9480
identifier other6835209.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1136245?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleAnalysis and Design of a Novel Low-Loss Hollow Substrate Integrated Waveguide
typeJournal Paper
contenttypeMetadata Only
identifier padid8317896
subject keywordsceramic packaging
subject keywordsdielectric waveguides
subject keywordsdielectric-loaded waveguides
subject keywordslaminations
subject keywordsmillimetre wave circuits
subject keywordsmultichip modules
subject keywordsnetwork synthesis
subject keywordsrectangular waveguides
subject keywordssubstrate integrated waveguides
subject keywordstransmission lines
subject keywordsHSIW prototype
subject keywordsair-filled RWG
subject keywordsdielectric constant
subject keywordsintegrated mmwave module
subject keywordslow-loss hollow substrate integrated waveguide
subject keywordslow-loss millimeter-wave transmission line
subject keywordsmmwave transmission line
subject keywordsmultichip module
subject keywordsprogressive-lamination low-temperature cofired ceramic tech
identifier doi10.1109/TMTT.2014.2328555
journal titleMicrowave Theory and Techniques, IEEE Transactions on
journal volume62
journal issue8
filesize1430178
citations0


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