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Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems

contributor authorMantooth, Homer Alan
contributor authorGlover, Michael D.
contributor authorShepherd, Peter
date accessioned2020-03-12T23:54:20Z
date available2020-03-12T23:54:20Z
date issued2014
identifier issn2168-6777
identifier other6777571.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1127542?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleWide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems
typeJournal Paper
contenttypeMetadata Only
identifier padid8307511
subject keywordselectronics packaging
subject keywordspower electronics
subject keywordselectronic packaging
subject keywordsintegrated driver
subject keywordspower electronic systems
subject keywordspower integrated circuits
subject keywordspower semiconductor devices
subject keywordsprotection circuitry
subject keywordswide band gap semiconductors
subject keywordswide bandgap device technology
subject keywordswide bandgap technologies
subject keywordsGallium nitride
subject keywordsMOSFET
subject keywordsPhotonic band gap
subject keywordsPower electronics
subject keywordsSilicon
subject keywordsSilicon carbide
subject keywordsGallium nitride (GaN)
subject keywordspower electronics
subject keywordspower integrated circuits
subject keywordspower semiconductor devices
subject keywordssilicon carbide (SiC)
subject keywordswide bandgap s
identifier doi10.1109/JESTPE.2014.2313511
journal titleEmerging and Selected Topics in Power Electronics, IEEE Journal of
journal volume2
journal issue3
filesize1566778
citations1


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