Electromigration testing of wire bonds

: 2014

یو آر آی: http://libsearch.um.ac.ir:80/fum/handle/fum/1117675

کالکشن :

contributor author	Hook, M. , Di Xu , Mayer, M.
date accessioned	2020-03-12T23:36:24Z
date available	2020-03-12T23:36:24Z
date issued	2014
identifier other	6901111.pdf
identifier uri	http://libsearch.um.ac.ir:80/fum/handle/fum/1117675?locale-attribute=fa
format	general
language	English
publisher	IEEE
title	Electromigration testing of wire bonds
type	Conference Paper
contenttype	Metadata Only
identifier padid	8287459
subject keywords	image registration
subject keywords	mobile robots
subject keywords	path planning
subject keywords	robot vision
subject keywords	sensor fusion
subject keywords	3D range data
subject keywords	autonomous robot exploration
subject keywords	eye-in-hand configuration
subject keywords	global registration
subject keywords	midrange 3D observation
subject keywords	next best view planning
subject keywords	point cloud model
subject keywords	range sensor
subject keywords	robot arm
subject keywords	sensor fusion
subject keywords	volumetric representation
subject keywords	Algorithm design and analysis
subject keywords	Manipulators
subject keywords	Planning
subject keywords	Robot sensing systems
subject keywords	Three-dimensional displays
identifier doi	10.1109/IROS.2014.6943077
journal title	lectrical and Computer Engineering (CCECE), 2014 IEEE 27th Canadian Conference on
filesize	8859335
citations	0

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