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Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal

contributor authorPoo Khai Yee
contributor authorWan Tatt Wai
contributor authorYong Foo Khong
date accessioned2020-03-12T23:32:44Z
date available2020-03-12T23:32:44Z
date issued2014
identifier other6898185.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1115503?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titlePalladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal
typeConference Paper
contenttypeMetadata Only
identifier padid8284962
subject keywordscellular biophysics
subject keywordsedge detection
subject keywordsfeature extraction
subject keywordsimage classification
subject keywordsmedical image processing
subject keywordscell culture
subject keywordscomputer vision systems
subject keywordsdrug development
subject keywordsiPSC colony image classification
subject keywordsinduced pluripotent stem cells
subject keywordslocal binary pattern extraction
subject keywordslocal oriented edge extraction
subject keywordslocal spatially-enhanced structural descriptors
subject keywordslocal spatially-enhanced textural descriptors
subject keywordsquality control process
subject keywordsregenerative medicine
subject keywordsFeature extraction
subject keywordsHistograms
subject keywordsImage edge detection
subject keywordsShape
subject keywordsSt
identifier doi10.1109/EMBC.2014.6944343
journal titlehysical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium o
filesize972464
citations0


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