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Identification of Cu-Al intermetallic phases of copper wire bonding using TEM nano beam diffraction indexing technique

contributor authorYong, F.K.
date accessioned2020-03-12T23:32:42Z
date available2020-03-12T23:32:42Z
date issued2014
identifier other6898172.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1115490?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleIdentification of Cu-Al intermetallic phases of copper wire bonding using TEM nano beam diffraction indexing technique
typeConference Paper
contenttypeMetadata Only
identifier padid8284944
subject keywordsBandwidth
subject keywordsFrequency response
subject keywordsLogic gates
subject keywordsLow voltage
subject keywordsMOSFET
subject keywordsThreshold voltage
subject keywordsDynamic threshold MOS Transistor
subject keywordsanalog integrated circuits
subject keywordsbandwidth
subject keywordslow voltage
subject keywordsvoltage follower
identifier doi10.1109/CIPECH.2014.7018211
journal titlehysical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium o
filesize2355991
citations0


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