Experimental demonstration of the effect of copper TPVs (Through package vias) on thermal performance of glass interposers
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: 2014DOI: 10.1109/EuRAD.2014.6991275
Keyword(s): Antenna arrays,Antenna feeds,Antenna measurements,Antenna radiation patterns,Arrays,Dielectrics,Imaging,active imaging system,antenna array,dielectric waveguide antenna,millimeter wave,wideband antenna
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Experimental demonstration of the effect of copper TPVs (Through package vias) on thermal performance of glass interposers
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| date accessioned | 2020-03-12T23:32:21Z | |
| date available | 2020-03-12T23:32:21Z | |
| date issued | 2014 | |
| identifier other | 6897451.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1115268?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Experimental demonstration of the effect of copper TPVs (Through package vias) on thermal performance of glass interposers | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284686 | |
| subject keywords | Antenna arrays | |
| subject keywords | Antenna feeds | |
| subject keywords | Antenna measurements | |
| subject keywords | Antenna radiation patterns | |
| subject keywords | Arrays | |
| subject keywords | Dielectrics | |
| subject keywords | Imaging | |
| subject keywords | active imaging system | |
| subject keywords | antenna array | |
| subject keywords | dielectric waveguide antenna | |
| subject keywords | millimeter wave | |
| subject keywords | wideband antenna | |
| identifier doi | 10.1109/EuRAD.2014.6991275 | |
| journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
| filesize | 2970823 | |
| citations | 0 | |
| contributor rawauthor | Sangbeom Cho , Sato, Y. , Sundaram, V. , Joshi, Y. , Tummala, R. |