A mechanical micropump for electronic cooling
| date accessioned | 2020-03-12T23:26:50Z | |
| date available | 2020-03-12T23:26:50Z | |
| date issued | 2014 | |
| identifier other | 6892395.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1111938?locale-attribute=en&show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | A mechanical micropump for electronic cooling | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8280806 | |
| subject keywords | finance | |
| subject keywords | risk analysis | |
| subject keywords | VaR measure | |
| subject keywords | crisp equivalents | |
| subject keywords | loan portfolio | |
| subject keywords | return rates | |
| subject keywords | risk measure method | |
| subject keywords | uncertain environment | |
| subject keywords | value at risk | |
| subject keywords | Educational institutions | |
| subject keywords | Measurement uncertainty | |
| subject keywords | Numerical models | |
| subject keywords | Optimization | |
| subject keywords | Portfolios | |
| subject keywords | Reactive power | |
| subject keywords | Uncertainty | |
| identifier doi | 10.1109/CSO.2014.158 | |
| journal title | hermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Confere | |
| filesize | 498993 | |
| citations | 1 | |
| contributor rawauthor | Bin Duan , Tinghui Guo , Minqing Luo , Xiaobing Luo |
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