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Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates

contributor authorFouzder, Tama
contributor authorChan, Y.C.
contributor authorChan, Daniel K.
date accessioned2020-03-12T22:53:22Z
date available2020-03-12T22:53:22Z
date issued2014
identifier other7028281.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1098068?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleInterfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates
typeConference Paper
contenttypeMetadata Only
identifier padid8239101
subject keywordsAccuracy
subject keywordsn Blogs
subject keywordsn Integrated circuits
subject keywordsn Testing
subject keywordsn Training
subject keywordsn Sentiment analysis
subject keywordsn intensifier
subject keywordsn objective words
subject keywordsn opinion mining
subject keywordsn sentiment polarity
subject keywordsn subjective words
identifier doi10.1109/ICRAIE.2014.6909220
journal titlelectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
filesize745232
citations0


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