Model identification for perfect tracking control of PA10 robot arm with joint velocity servo driver
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: 2014DOI: 10.1109/NEMS.2014.6908822
Keyword(s): accelerometers,n electronics packaging,n silicon-on-insulator,n thermal stresses,n MEMS sensors,n SOI sandwich differential capacitance accelerometer,n device bending,n glass electrode plates,n low stress package,n metal hermetic package case,n temperature compensation,n thermal stress,n thin silicon middle layer,n Accelerometers,n Electrodes,n Glass,n Sensors,n Silicon,n Stress,n Thermal stresses,n Accelerometer,n Capacitance,n D
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Model identification for perfect tracking control of PA10 robot arm with joint velocity servo driver
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| contributor author | Shimizu, Masayuki | |
| date accessioned | 2020-03-12T22:53:02Z | |
| date available | 2020-03-12T22:53:02Z | |
| date issued | 2014 | |
| identifier other | 7028070.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1097868 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Model identification for perfect tracking control of PA10 robot arm with joint velocity servo driver | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8238832 | |
| subject keywords | accelerometers | |
| subject keywords | n electronics packaging | |
| subject keywords | n silicon-on-insulator | |
| subject keywords | n thermal stresses | |
| subject keywords | n MEMS sensors | |
| subject keywords | n SOI sandwich differential capacitance accelerometer | |
| subject keywords | n device bending | |
| subject keywords | n glass electrode plates | |
| subject keywords | n low stress package | |
| subject keywords | n metal hermetic package case | |
| subject keywords | n temperature compensation | |
| subject keywords | n thermal stress | |
| subject keywords | n thin silicon middle layer | |
| subject keywords | n Accelerometers | |
| subject keywords | n Electrodes | |
| subject keywords | n Glass | |
| subject keywords | n Sensors | |
| subject keywords | n Silicon | |
| subject keywords | n Stress | |
| subject keywords | n Thermal stresses | |
| subject keywords | n Accelerometer | |
| subject keywords | n Capacitance | |
| subject keywords | n D | |
| identifier doi | 10.1109/NEMS.2014.6908822 | |
| journal title | ystem Integration (SII), 2014 IEEE/SICE International Symposium on | |
| filesize | 486542 | |
| citations | 0 |