NDM'14 Workshop Organization
Publisher:
Year
: 2014DOI: 10.1109/ECTC.2014.6897604
Keyword(s): bonding processes,n copper,n electronics packaging,n nanocomposites,n nanoparticles,n particle size,n reliability,n silver,n sintering,n thermal conductivity,n thermal expansion,n thermal resistance,n thermal shock,n thermomechanical treatment,n bulk thermal conductivity,n coefficient of thermal expansion,n copper micropowders,n electronics packaging,n heat dissipation,n high mechanical bond strength,n interfacial engineering,n low i
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NDM'14 Workshop Organization
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| date accessioned | 2020-03-12T22:38:18Z | |
| date available | 2020-03-12T22:38:18Z | |
| date issued | 2014 | |
| identifier other | 7017635.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1089563?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | NDM'14 Workshop Organization | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227801 | |
| subject keywords | bonding processes | |
| subject keywords | n copper | |
| subject keywords | n electronics packaging | |
| subject keywords | n nanocomposites | |
| subject keywords | n nanoparticles | |
| subject keywords | n particle size | |
| subject keywords | n reliability | |
| subject keywords | n silver | |
| subject keywords | n sintering | |
| subject keywords | n thermal conductivity | |
| subject keywords | n thermal expansion | |
| subject keywords | n thermal resistance | |
| subject keywords | n thermal shock | |
| subject keywords | n thermomechanical treatment | |
| subject keywords | n bulk thermal conductivity | |
| subject keywords | n coefficient of thermal expansion | |
| subject keywords | n copper micropowders | |
| subject keywords | n electronics packaging | |
| subject keywords | n heat dissipation | |
| subject keywords | n high mechanical bond strength | |
| subject keywords | n interfacial engineering | |
| subject keywords | n low i | |
| identifier doi | 10.1109/ECTC.2014.6897604 | |
| journal title | etwork-Aware Data Management (NDM), 2014 Fourth International Workshop on | |
| filesize | 79984 | |
| citations | 0 |