Mesoporous hybrid membrane based label free electrochemical immunoassay
Publisher:
Year
: 2014DOI: 10.1109/ECTC.2014.6897587
Keyword(s): electronics packaging,n thermal analysis,n JEDEC package level test,n chipsets junction temperature,n device skin temperature,n electronics component,n handheld device,n matrix method,n thermal analysis,n thermal characterization,n thermal coupling effect,n thermal network,n Electronic packaging thermal management,n Handheld computers,n Heating,n Load modeling,n Skin,n Temperature distribution,n Thermal analysis
Collections
:
-
Statistics
Mesoporous hybrid membrane based label free electrochemical immunoassay
Show full item record
| contributor author | Pamsubsakul, A. | |
| contributor author | Rijiravanich, P. | |
| contributor author | Surareungchai, W. | |
| date accessioned | 2020-03-12T22:38:16Z | |
| date available | 2020-03-12T22:38:16Z | |
| date issued | 2014 | |
| identifier other | 7017442.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1089546?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Mesoporous hybrid membrane based label free electrochemical immunoassay | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227781 | |
| subject keywords | electronics packaging | |
| subject keywords | n thermal analysis | |
| subject keywords | n JEDEC package level test | |
| subject keywords | n chipsets junction temperature | |
| subject keywords | n device skin temperature | |
| subject keywords | n electronics component | |
| subject keywords | n handheld device | |
| subject keywords | n matrix method | |
| subject keywords | n thermal analysis | |
| subject keywords | n thermal characterization | |
| subject keywords | n thermal coupling effect | |
| subject keywords | n thermal network | |
| subject keywords | n Electronic packaging thermal management | |
| subject keywords | n Handheld computers | |
| subject keywords | n Heating | |
| subject keywords | n Load modeling | |
| subject keywords | n Skin | |
| subject keywords | n Temperature distribution | |
| subject keywords | n Thermal analysis | |
| identifier doi | 10.1109/ECTC.2014.6897587 | |
| journal title | iomedical Engineering International Conference (BMEiCON), 2014 7th | |
| filesize | 686327 | |
| citations | 0 |