•  English
    • Persian
    • English
  •   Login
  • Ferdowsi University of Mashhad
  • |
  • Information Center and Central Library
    • Persian
    • English
  • Home
  • Source Types
    • Journal Paper
    • Ebook
    • Conference Paper
    • Standard
    • Protocol
    • Thesis
  • Use Help
View Item 
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  • All Fields
  • Title
  • Author
  • Year
  • Publisher
  • Subject
  • Publication Title
  • ISSN
  • DOI
  • ISBN
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

Virtual reality game for memory skills enhancement based on QEEG

Author:
Anopas, D.
,
Wongsawat, Y.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ECTC.2014.6897544
URI: http://libsearch.um.ac.ir:80/fum/handle/fum/1089504
Keyword(s): integrated circuit packaging,n organic insulating materials,n three-dimensional integrated circuits,n 2.5D IC packaging,n 3D IC packaging,n low temperature curable organic insulation materials,n process compatibility,n variable frequency microwave oven,n wafer back side processing,n Chemicals,n Coatings,n Curing,n Materials,n Resistance,n Temperature,n Thermal stability
Collections :
  • Latin Articles
  • Show Full MetaData Hide Full MetaData
  • Statistics

    Virtual reality game for memory skills enhancement based on QEEG

Show full item record

contributor authorAnopas, D.
contributor authorWongsawat, Y.
date accessioned2020-03-12T22:38:12Z
date available2020-03-12T22:38:12Z
date issued2014
identifier other7017399.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1089504
formatgeneral
languageEnglish
publisherIEEE
titleVirtual reality game for memory skills enhancement based on QEEG
typeConference Paper
contenttypeMetadata Only
identifier padid8227726
subject keywordsintegrated circuit packaging
subject keywordsn organic insulating materials
subject keywordsn three-dimensional integrated circuits
subject keywordsn 2.5D IC packaging
subject keywordsn 3D IC packaging
subject keywordsn low temperature curable organic insulation materials
subject keywordsn process compatibility
subject keywordsn variable frequency microwave oven
subject keywordsn wafer back side processing
subject keywordsn Chemicals
subject keywordsn Coatings
subject keywordsn Curing
subject keywordsn Materials
subject keywordsn Resistance
subject keywordsn Temperature
subject keywordsn Thermal stability
identifier doi10.1109/ECTC.2014.6897544
journal titleiomedical Engineering International Conference (BMEiCON), 2014 7th
filesize938674
citations1
  • About Us
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
DSpace software copyright © 2019-2022  DuraSpace