CMP process — Integrated chemical & physical phenomena in between wafer and polishing pad
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Year
: 2014DOI: 10.1109/ECTC.2014.6897398
Keyword(s): optimisation,n reliability,n surface mount technology,n wafer level packaging,n SMT process optimization,n board level reliability,n board level temperature cycle,n pitch wafer level packages,n stencil aperture ratios,n surface mount assembly,n temperature cycling reliability,n test vehicles,n Assembly,n Electric shock,n Passivation,n Semiconductor device reliability,n Temperature measurement,n Vehicles
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CMP process — Integrated chemical & physical phenomena in between wafer and polishing pad
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| contributor author | Kimura, K. | |
| contributor author | Chen, C.-C.A. | |
| date accessioned | 2020-03-12T22:37:55Z | |
| date available | 2020-03-12T22:37:55Z | |
| date issued | 2014 | |
| identifier other | 7017251.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1089352?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | CMP process — Integrated chemical & physical phenomena in between wafer and polishing pad | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227554 | |
| subject keywords | optimisation | |
| subject keywords | n reliability | |
| subject keywords | n surface mount technology | |
| subject keywords | n wafer level packaging | |
| subject keywords | n SMT process optimization | |
| subject keywords | n board level reliability | |
| subject keywords | n board level temperature cycle | |
| subject keywords | n pitch wafer level packages | |
| subject keywords | n stencil aperture ratios | |
| subject keywords | n surface mount assembly | |
| subject keywords | n temperature cycling reliability | |
| subject keywords | n test vehicles | |
| subject keywords | n Assembly | |
| subject keywords | n Electric shock | |
| subject keywords | n Passivation | |
| subject keywords | n Semiconductor device reliability | |
| subject keywords | n Temperature measurement | |
| subject keywords | n Vehicles | |
| identifier doi | 10.1109/ECTC.2014.6897398 | |
| journal title | lanarization/CMP Technology (ICPT), 2014 International Conference on | |
| filesize | 932833 | |
| citations | 0 |