Equalization-based enterprise service selection
Publisher:
Year
: 2014DOI: 10.1109/ECTC.2014.6897315
Keyword(s): X-ray diffraction,n ageing,n ball grid arrays,n creep,n elasticity,n failure analysis,n nanoindentation,n plasticity,n printed circuits,n reliability,n solders,n stress effects,n PBGA assembly,n SAC lead free solder joint,n SAC105 test board,n SAC205 test board,n SAC305 test board,n SAC405 test board,n X-ray microdiffraction technique,n aging induced solder joint evolution,n creep behavior,n grain boundary sliding creep mechanism
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Equalization-based enterprise service selection
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| contributor author | Xue Xiao | |
| contributor author | Wang Shufang | |
| date accessioned | 2020-03-12T22:37:44Z | |
| date available | 2020-03-12T22:37:44Z | |
| date issued | 2014 | |
| identifier other | 7017167.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1089254?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Equalization-based enterprise service selection | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227435 | |
| subject keywords | X-ray diffraction | |
| subject keywords | n ageing | |
| subject keywords | n ball grid arrays | |
| subject keywords | n creep | |
| subject keywords | n elasticity | |
| subject keywords | n failure analysis | |
| subject keywords | n nanoindentation | |
| subject keywords | n plasticity | |
| subject keywords | n printed circuits | |
| subject keywords | n reliability | |
| subject keywords | n solders | |
| subject keywords | n stress effects | |
| subject keywords | n PBGA assembly | |
| subject keywords | n SAC lead free solder joint | |
| subject keywords | n SAC105 test board | |
| subject keywords | n SAC205 test board | |
| subject keywords | n SAC305 test board | |
| subject keywords | n SAC405 test board | |
| subject keywords | n X-ray microdiffraction technique | |
| subject keywords | n aging induced solder joint evolution | |
| subject keywords | n creep behavior | |
| subject keywords | n grain boundary sliding creep mechanism | |
| identifier doi | 10.1109/ECTC.2014.6897315 | |
| journal title | omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE | |
| filesize | 288820 | |
| citations | 0 |