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System design of social insecurity analysis based on public involvement for management of public tranquility and order

contributor authorHandoyo, K.M.
contributor authorAlbarda
contributor authorAhmadi, A.
date accessioned2020-03-12T22:31:20Z
date available2020-03-12T22:31:20Z
date issued2014
identifier other7013159.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1085821?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleSystem design of social insecurity analysis based on public involvement for management of public tranquility and order
typeConference Paper
contenttypeMetadata Only
identifier padid8223369
subject keywordscircuit optimisation
subject keywordsn copper
subject keywordsn electronics packaging
subject keywordsn flip-chip devices
subject keywordsn integrated circuit interconnections
subject keywordsn integrated circuit reliability
subject keywordsn low-k dielectric thin films
subject keywordsn solders
subject keywordsn BEoL-fBEoL reliability
subject keywordsn Cu
subject keywordsn Cu-Low-k interconnects
subject keywordsn back-end-of-line
subject keywordsn bump footprint
subject keywordsn die attach process
subject keywordsn die attach reflow process
subject keywordsn die to substrate size ratio
subject keywordsn dielectric damage
subject keywordsn flip-chip attachment process
subject keywordsn flip-chip package
subject keywordsn mainstream elec
identifier doi10.1109/ITHERM.2014.6892320
journal titleCT For Smart Society (ICISS), 2014 International Conference on
filesize656514
citations0


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