Robust coupling-observer-based sliding mode control for flexible air-breathing hypersonic vehicles
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سال
: 2014شناسه الکترونیک: 10.1109/LTB-3D.2014.6886194
کلیدواژه(گان): annealing,n interface structure,n silicon compounds,n tensile strength,n voids (solid),n wafer bonding,n wide band gap semiconductors,n 4H-SiC wafer bonding,n SiC,n annealing,n interface structure,n modified suface activated bonding method,n temperature 293 K to 298 K,n tensile strength,n time 300 s,n voids,n Annealing,n Bonding,n Educational institutions,n Iron,n Silicon,n Silicon carbide,n Wafer bonding
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Robust coupling-observer-based sliding mode control for flexible air-breathing hypersonic vehicles
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| contributor author | Wang, Na | |
| contributor author | Li, Wen-Shuo | |
| contributor author | Guo, Lei | |
| contributor author | Han, Hui-Lian | |
| date accessioned | 2020-03-12T22:24:07Z | |
| date available | 2020-03-12T22:24:07Z | |
| date issued | 2014 | |
| identifier other | 7007404.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1081767 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Robust coupling-observer-based sliding mode control for flexible air-breathing hypersonic vehicles | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8218292 | |
| subject keywords | annealing | |
| subject keywords | n interface structure | |
| subject keywords | n silicon compounds | |
| subject keywords | n tensile strength | |
| subject keywords | n voids (solid) | |
| subject keywords | n wafer bonding | |
| subject keywords | n wide band gap semiconductors | |
| subject keywords | n 4H-SiC wafer bonding | |
| subject keywords | n SiC | |
| subject keywords | n annealing | |
| subject keywords | n interface structure | |
| subject keywords | n modified suface activated bonding method | |
| subject keywords | n temperature 293 K to 298 K | |
| subject keywords | n tensile strength | |
| subject keywords | n time 300 s | |
| subject keywords | n voids | |
| subject keywords | n Annealing | |
| subject keywords | n Bonding | |
| subject keywords | n Educational institutions | |
| subject keywords | n Iron | |
| subject keywords | n Silicon | |
| subject keywords | n Silicon carbide | |
| subject keywords | n Wafer bonding | |
| identifier doi | 10.1109/LTB-3D.2014.6886194 | |
| journal title | uidance, Navigation and Control Conference (CGNCC), 2014 IEEE Chinese | |
| filesize | 259650 | |
| citations | 0 |