Tracking micro reentering USV with multi-sensors using fusion CKF algorithm
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Year
: 2014DOI: 10.1109/LTB-3D.2014.6886173
Keyword(s): cryogenic electronics,n lead bonding,n micromechanical devices,n stress effects,n three-dimensional integrated circuits,n wafer bonding,n 3D-IC,n MEMS,n fragile dielectric layers,n heterogeneous integration,n low-temperature bonding technologies,n sensitive mechanical structures,n stress-induced failures,n temperature-sensitive materials,n thinned wafers,n transistor stress sensitivity,n Bonding,n Materials,n Micromechanical devices,n Plas
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Tracking micro reentering USV with multi-sensors using fusion CKF algorithm
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| contributor author | Huang, P. | |
| contributor author | Qian, S. | |
| contributor author | Li, H.N. | |
| date accessioned | 2020-03-12T22:24:05Z | |
| date available | 2020-03-12T22:24:05Z | |
| date issued | 2014 | |
| identifier other | 7007383.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1081746?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Tracking micro reentering USV with multi-sensors using fusion CKF algorithm | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8218269 | |
| subject keywords | cryogenic electronics | |
| subject keywords | n lead bonding | |
| subject keywords | n micromechanical devices | |
| subject keywords | n stress effects | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n wafer bonding | |
| subject keywords | n 3D-IC | |
| subject keywords | n MEMS | |
| subject keywords | n fragile dielectric layers | |
| subject keywords | n heterogeneous integration | |
| subject keywords | n low-temperature bonding technologies | |
| subject keywords | n sensitive mechanical structures | |
| subject keywords | n stress-induced failures | |
| subject keywords | n temperature-sensitive materials | |
| subject keywords | n thinned wafers | |
| subject keywords | n transistor stress sensitivity | |
| subject keywords | n Bonding | |
| subject keywords | n Materials | |
| subject keywords | n Micromechanical devices | |
| subject keywords | n Plas | |
| identifier doi | 10.1109/LTB-3D.2014.6886173 | |
| journal title | uidance, Navigation and Control Conference (CGNCC), 2014 IEEE Chinese | |
| filesize | 170109 | |
| citations | 0 |