Real-time active noise control of multi-tones and MRI acoustic noise in fMRI bore with signal decomposition and parallel hybrid RLS-NLMS adaptive algorithms
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: 2014DOI: 10.1109/VLSI-DAT.2014.6834862
Keyword(s): integrated circuit modelling,n integrated circuit yield,n thermal stresses,n three-dimensional integrated circuits,n 3D integration,n KOZ overhead,n TSV,n area overhead,n fabrication cost,n keep-out-zone analysis,n thermal stresses,n three-dimensional integrated circuits,n through silicon via,n Fabrication,n Multiplexing,n Silicon,n Stress,n Thermal stresses,n Three-dimensional displays,n Through-silicon vias
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Real-time active noise control of multi-tones and MRI acoustic noise in fMRI bore with signal decomposition and parallel hybrid RLS-NLMS adaptive algorithms
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| contributor author | Krishna Vemuri, S.H. | |
| contributor author | Ganguly, A. | |
| contributor author | Panahi, I. | |
| date accessioned | 2020-03-12T21:55:07Z | |
| date available | 2020-03-12T21:55:07Z | |
| date issued | 2014 | |
| identifier other | 6965339.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1065077 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Real-time active noise control of multi-tones and MRI acoustic noise in fMRI bore with signal decomposition and parallel hybrid RLS-NLMS adaptive algorithms | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8198346 | |
| subject keywords | integrated circuit modelling | |
| subject keywords | n integrated circuit yield | |
| subject keywords | n thermal stresses | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n 3D integration | |
| subject keywords | n KOZ overhead | |
| subject keywords | n TSV | |
| subject keywords | n area overhead | |
| subject keywords | n fabrication cost | |
| subject keywords | n keep-out-zone analysis | |
| subject keywords | n thermal stresses | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n through silicon via | |
| subject keywords | n Fabrication | |
| subject keywords | n Multiplexing | |
| subject keywords | n Silicon | |
| subject keywords | n Stress | |
| subject keywords | n Thermal stresses | |
| subject keywords | n Three-dimensional displays | |
| subject keywords | n Through-silicon vias | |
| identifier doi | 10.1109/VLSI-DAT.2014.6834862 | |
| journal title | ircuits and Systems Conference (DCAS), 2014 IEEE Dallas | |
| filesize | 752333 | |
| citations | 0 |