OPTIMUS: OPTImized Mail distribUtion System
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Year
: 2014DOI: 10.1109/IITC.2014.6831858
Keyword(s): copper,n electromigration,n integrated circuit interconnections,n integrated circuit reliability,n vias,n voids (solid),n Cu,n copper interconnect,n electromigration process,n interconnects reliability,n lifetime prediction,n local sense structure,n small resistance measurement,n standard single via structure,n void formation,n void nucleation,n Electrical resistance measurement,n Electromigration,n Periodic structures,n Reliability,n R
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OPTIMUS: OPTImized Mail distribUtion System
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| contributor author | Rosato, F. | |
| contributor author | Arguello, J. | |
| contributor author | Cardinale, Y. | |
| date accessioned | 2020-03-12T21:54:52Z | |
| date available | 2020-03-12T21:54:52Z | |
| date issued | 2014 | |
| identifier other | 6965137.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1064928 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | OPTIMUS: OPTImized Mail distribUtion System | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8198124 | |
| subject keywords | copper | |
| subject keywords | n electromigration | |
| subject keywords | n integrated circuit interconnections | |
| subject keywords | n integrated circuit reliability | |
| subject keywords | n vias | |
| subject keywords | n voids (solid) | |
| subject keywords | n Cu | |
| subject keywords | n copper interconnect | |
| subject keywords | n electromigration process | |
| subject keywords | n interconnects reliability | |
| subject keywords | n lifetime prediction | |
| subject keywords | n local sense structure | |
| subject keywords | n small resistance measurement | |
| subject keywords | n standard single via structure | |
| subject keywords | n void formation | |
| subject keywords | n void nucleation | |
| subject keywords | n Electrical resistance measurement | |
| subject keywords | n Electromigration | |
| subject keywords | n Periodic structures | |
| subject keywords | n Reliability | |
| subject keywords | n R | |
| identifier doi | 10.1109/IITC.2014.6831858 | |
| journal title | omputing Conference (CLEI), 2014 XL Latin American | |
| filesize | 406411 | |
| citations | 0 |