A new method based on wavelet and greedy pusuit analysis for neuro-spike detection
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سال
: 2014شناسه الکترونیک: 10.1109/ICEP.2014.6826688
کلیدواژه(گان): circuit reliability,n contamination,n copper alloys,n corrosion testing,n creep testing,n metallisation,n printed circuit testing,n silver alloys,n sulphur,n Ag,n Cu,n FOS based qualification test,n FOS chamber performance,n International Electronics Manufacturing Initiative,n MFG,n PCBs,n S,n air velocity effect,n board surfaces,n contaminants,n copper corrosion rates,n copper creep corrosion,n copper foils,n copper metallizat
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A new method based on wavelet and greedy pusuit analysis for neuro-spike detection
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| contributor author | Junwei Duan | |
| contributor author | Long Chen | |
| contributor author | Chen, C.L.Philip | |
| date accessioned | 2020-03-12T21:51:38Z | |
| date available | 2020-03-12T21:51:38Z | |
| date issued | 2014 | |
| identifier other | 6961819.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1063074?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | A new method based on wavelet and greedy pusuit analysis for neuro-spike detection | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8195160 | |
| subject keywords | circuit reliability | |
| subject keywords | n contamination | |
| subject keywords | n copper alloys | |
| subject keywords | n corrosion testing | |
| subject keywords | n creep testing | |
| subject keywords | n metallisation | |
| subject keywords | n printed circuit testing | |
| subject keywords | n silver alloys | |
| subject keywords | n sulphur | |
| subject keywords | n Ag | |
| subject keywords | n Cu | |
| subject keywords | n FOS based qualification test | |
| subject keywords | n FOS chamber performance | |
| subject keywords | n International Electronics Manufacturing Initiative | |
| subject keywords | n MFG | |
| subject keywords | n PCBs | |
| subject keywords | n S | |
| subject keywords | n air velocity effect | |
| subject keywords | n board surfaces | |
| subject keywords | n contaminants | |
| subject keywords | n copper corrosion rates | |
| subject keywords | n copper creep corrosion | |
| subject keywords | n copper foils | |
| subject keywords | n copper metallizat | |
| identifier doi | 10.1109/ICEP.2014.6826688 | |
| journal title | nformative and Cybernetics for Computational Social Systems (ICCSS), 2014 International Conference o | |
| filesize | 476576 | |
| citations | 0 |