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A new method based on wavelet and greedy pusuit analysis for neuro-spike detection

Author:
Junwei Duan
,
Long Chen
,
Chen, C.L.Philip
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ICEP.2014.6826688
URI: http://libsearch.um.ac.ir:80/fum/handle/fum/1063074
Keyword(s): circuit reliability,n contamination,n copper alloys,n corrosion testing,n creep testing,n metallisation,n printed circuit testing,n silver alloys,n sulphur,n Ag,n Cu,n FOS based qualification test,n FOS chamber performance,n International Electronics Manufacturing Initiative,n MFG,n PCBs,n S,n air velocity effect,n board surfaces,n contaminants,n copper corrosion rates,n copper creep corrosion,n copper foils,n copper metallizat
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    A new method based on wavelet and greedy pusuit analysis for neuro-spike detection

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contributor authorJunwei Duan
contributor authorLong Chen
contributor authorChen, C.L.Philip
date accessioned2020-03-12T21:51:38Z
date available2020-03-12T21:51:38Z
date issued2014
identifier other6961819.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1063074?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleA new method based on wavelet and greedy pusuit analysis for neuro-spike detection
typeConference Paper
contenttypeMetadata Only
identifier padid8195160
subject keywordscircuit reliability
subject keywordsn contamination
subject keywordsn copper alloys
subject keywordsn corrosion testing
subject keywordsn creep testing
subject keywordsn metallisation
subject keywordsn printed circuit testing
subject keywordsn silver alloys
subject keywordsn sulphur
subject keywordsn Ag
subject keywordsn Cu
subject keywordsn FOS based qualification test
subject keywordsn FOS chamber performance
subject keywordsn International Electronics Manufacturing Initiative
subject keywordsn MFG
subject keywordsn PCBs
subject keywordsn S
subject keywordsn air velocity effect
subject keywordsn board surfaces
subject keywordsn contaminants
subject keywordsn copper corrosion rates
subject keywordsn copper creep corrosion
subject keywordsn copper foils
subject keywordsn copper metallizat
identifier doi10.1109/ICEP.2014.6826688
journal titlenformative and Cybernetics for Computational Social Systems (ICCSS), 2014 International Conference o
filesize476576
citations0
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