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date accessioned	2020-03-12T21:51:36Z
date available	2020-03-12T21:51:36Z
date issued	2014
identifier other	6961800.pdf
identifier uri	http://libsearch.um.ac.ir:80/fum/handle/fum/1063057?locale-attribute=en
format	general
language	English
publisher	IEEE
title	Table of contents
type	Conference Paper
contenttype	Metadata Only
identifier padid	8195141
subject keywords	finite element analysis
subject keywords	n reflow soldering
subject keywords	n semiconductor device packaging
subject keywords	n system-in-package
subject keywords	n thermal stress cracking
subject keywords	n thermal stresses
subject keywords	n three-dimensional integrated circuits
subject keywords	n voids (solid)
subject keywords	n yield stress
subject keywords	n 3D SiP
subject keywords	n Cu
subject keywords	n FEM
subject keywords	n Si
subject keywords	n TSV low cycle fatigue
subject keywords	n TSV structure
subject keywords	n bending strength
subject keywords	n bending stress
subject keywords	n device operation conditions
subject keywords	n finite element method
subject keywords	n materials interface
subject keywords	n maximum principal stress
subject keywords	n reflow process
identifier doi	10.1109/ICEP.2014.6826670
journal title	ischarges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
filesize	278585
citations	0

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