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Manufacturing of 3D integrated sensors and circuits

contributor authorSchrems, M.
contributor authorSiegert, J.
contributor authorDorfi, P.
contributor authorKraft, J.
contributor authorStueckler, E.
contributor authorSchrank, F.
contributor authorSelberherr, S.
date accessioned2020-03-12T21:35:59Z
date available2020-03-12T21:35:59Z
date issued2014
identifier other6948785.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1054108?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleManufacturing of 3D integrated sensors and circuits
typeConference Paper
contenttypeMetadata Only
identifier padid8184620
subject keywordsbin packing
subject keywordsn parallel algorithms
subject keywordsn Hadoop cluster organization
subject keywordsn MapReduce
subject keywordsn distributed computing
subject keywordsn generalized one-dimensional bin packing problem parallelizing
subject keywordsn programming model
subject keywordsn Algorithm design and analysis
subject keywordsn Approximation algorithms
subject keywordsn Clustering algorithms
subject keywordsn Computers
subject keywordsn Distributed computing
subject keywordsn Dynamic programming
subject keywordsn Heuristic algorithms
subject keywordsn First Fit Decreasing
subject keywordsn Generalized Bin Packing
subject keywordsn Hadoop
subject keywordsn MapReduce
subject keywordsn Parallelizing
identifier doi10.1109/IAdCC.2014.6779397
journal titleolid State Device Research Conference (ESSDERC), 2014 44th European
filesize4809030
citations0


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