•  English
    • Persian
    • English
  •   Login
  • Ferdowsi University of Mashhad
  • |
  • Information Center and Central Library
    • Persian
    • English
  • Home
  • Source Types
    • Journal Paper
    • Ebook
    • Conference Paper
    • Standard
    • Protocol
    • Thesis
  • Use Help
View Item 
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  • All Fields
  • Title
  • Author
  • Year
  • Publisher
  • Subject
  • Publication Title
  • ISSN
  • DOI
  • ISBN
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

Manufacturing of 3D integrated sensors and circuits

Author:
Schrems, M.
,
Siegert, J.
,
Dorfi, P.
,
Kraft, J.
,
Stueckler, E.
,
Schrank, F.
,
Selberherr, S.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/IAdCC.2014.6779397
URI: http://libsearch.um.ac.ir:80/fum/handle/fum/1054108
Keyword(s): bin packing,n parallel algorithms,n Hadoop cluster organization,n MapReduce,n distributed computing,n generalized one-dimensional bin packing problem parallelizing,n programming model,n Algorithm design and analysis,n Approximation algorithms,n Clustering algorithms,n Computers,n Distributed computing,n Dynamic programming,n Heuristic algorithms,n First Fit Decreasing,n Generalized Bin Packing,n Hadoop,n MapReduce,n Parallelizing
Collections :
  • Latin Articles
  • Show Full MetaData Hide Full MetaData
  • Statistics

    Manufacturing of 3D integrated sensors and circuits

Show full item record

contributor authorSchrems, M.
contributor authorSiegert, J.
contributor authorDorfi, P.
contributor authorKraft, J.
contributor authorStueckler, E.
contributor authorSchrank, F.
contributor authorSelberherr, S.
date accessioned2020-03-12T21:35:59Z
date available2020-03-12T21:35:59Z
date issued2014
identifier other6948785.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1054108?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleManufacturing of 3D integrated sensors and circuits
typeConference Paper
contenttypeMetadata Only
identifier padid8184620
subject keywordsbin packing
subject keywordsn parallel algorithms
subject keywordsn Hadoop cluster organization
subject keywordsn MapReduce
subject keywordsn distributed computing
subject keywordsn generalized one-dimensional bin packing problem parallelizing
subject keywordsn programming model
subject keywordsn Algorithm design and analysis
subject keywordsn Approximation algorithms
subject keywordsn Clustering algorithms
subject keywordsn Computers
subject keywordsn Distributed computing
subject keywordsn Dynamic programming
subject keywordsn Heuristic algorithms
subject keywordsn First Fit Decreasing
subject keywordsn Generalized Bin Packing
subject keywordsn Hadoop
subject keywordsn MapReduce
subject keywordsn Parallelizing
identifier doi10.1109/IAdCC.2014.6779397
journal titleolid State Device Research Conference (ESSDERC), 2014 44th European
filesize4809030
citations0
  • About Us
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
DSpace software copyright © 2019-2022  DuraSpace