Do neighbor buddies make a difference in reblog likelihood? An analysis on SINA Weibo data
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: 2014DOI: 10.1109/ICEPT.2014.6922733
Keyword(s): cooling,finite element analysis,heat conduction,insulated gate bipolar transistors,semiconductor device packaging,ANSYS software,double-sided cooling IGBT module,double-sided cooling structure unit,heat conduction model,heat dissipation performance,mathematical model,simulation calculation,single-sided cooling structure unit,steady state heat conduction,thermal boundary condition,thermal performance investigation,three-dimensional IGBT module packaging,three-dimensional structur
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Do neighbor buddies make a difference in reblog likelihood? An analysis on SINA Weibo data
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| contributor author | Lumin Zhang | |
| contributor author | Jian Pei | |
| contributor author | Yan Jia | |
| contributor author | Bin Zhou | |
| contributor author | Xiang Wang | |
| date accessioned | 2020-03-12T21:02:08Z | |
| date available | 2020-03-12T21:02:08Z | |
| date issued | 2014 | |
| identifier other | 6921585.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1034686?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Do neighbor buddies make a difference in reblog likelihood? An analysis on SINA Weibo data | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8160626 | |
| subject keywords | cooling | |
| subject keywords | finite element analysis | |
| subject keywords | heat conduction | |
| subject keywords | insulated gate bipolar transistors | |
| subject keywords | semiconductor device packaging | |
| subject keywords | ANSYS software | |
| subject keywords | double-sided cooling IGBT module | |
| subject keywords | double-sided cooling structure unit | |
| subject keywords | heat conduction model | |
| subject keywords | heat dissipation performance | |
| subject keywords | mathematical model | |
| subject keywords | simulation calculation | |
| subject keywords | single-sided cooling structure unit | |
| subject keywords | steady state heat conduction | |
| subject keywords | thermal boundary condition | |
| subject keywords | thermal performance investigation | |
| subject keywords | three-dimensional IGBT module packaging | |
| subject keywords | three-dimensional structur | |
| identifier doi | 10.1109/ICEPT.2014.6922733 | |
| journal title | dvances in Social Networks Analysis and Mining (ASONAM), 2014 IEEE/ACM International Conference on | |
| filesize | 272132 | |
| citations | 0 |