•  English
    • Persian
    • English
  •   Login
  • Ferdowsi University of Mashhad
  • |
  • Information Center and Central Library
    • Persian
    • English
  • Home
  • Source Types
    • Journal Paper
    • Ebook
    • Conference Paper
    • Standard
    • Protocol
    • Thesis
  • Use Help
View Item 
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  • All Fields
  • Title
  • Author
  • Year
  • Publisher
  • Subject
  • Publication Title
  • ISSN
  • DOI
  • ISBN
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

An optimization approach to bearing-only visual homing with applications to a 2-D unicycle model

Author:
Tron, R. , Daniilidis, K.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ICEPT.2014.6922693
URI: http://libsearch.um.ac.ir:80/fum/handle/fum/1026338
Keyword(s): ball grid arrays,cracks,reflow soldering,reliability,backward compatible assembled BGA joint,crack phenomenon,low-melting point alloy re-melting process,mixed BGA joint solder quality,mixed BGA joint solder reliability,reflow process,soldering process,waving process,Joints,Lead,Reflow soldering,Reliability,cracking mechanism,low melting point alloy,mixed BGA joint,reliability
Collections :
  • Latin Articles
  • Show Full MetaData Hide Full MetaData
  • Statistics

    An optimization approach to bearing-only visual homing with applications to a 2-D unicycle model

Show full item record

contributor authorTron, R. , Daniilidis, K.
date accessioned2020-03-12T20:48:40Z
date available2020-03-12T20:48:40Z
date issued2014
identifier other6907475.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1026338?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleAn optimization approach to bearing-only visual homing with applications to a 2-D unicycle model
typeConference Paper
contenttypeMetadata Only
identifier padid8151365
subject keywordsball grid arrays
subject keywordscracks
subject keywordsreflow soldering
subject keywordsreliability
subject keywordsbackward compatible assembled BGA joint
subject keywordscrack phenomenon
subject keywordslow-melting point alloy re-melting process
subject keywordsmixed BGA joint solder quality
subject keywordsmixed BGA joint solder reliability
subject keywordsreflow process
subject keywordssoldering process
subject keywordswaving process
subject keywordsJoints
subject keywordsLead
subject keywordsReflow soldering
subject keywordsReliability
subject keywordscracking mechanism
subject keywordslow melting point alloy
subject keywordsmixed BGA joint
subject keywordsreliability
identifier doi10.1109/ICEPT.2014.6922693
journal titleobotics and Automation (ICRA), 2014 IEEE International Conference on
filesize657640
citations0
  • About Us
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
DSpace software copyright © 2019-2022  DuraSpace