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Low complexity cloud-video-mixing using HEVC

Author:
Sanchez, Y. , Globisch, R. , Schierl, T. , Wiegand, T.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ICPT.2014.7017269
URI: http://libsearch.um.ac.ir:80/fum/handle/fum/1012258
Keyword(s): abrasives,chemical mechanical polishing,copper,wear,Cu,copper barrier CMP applications,longer pad life time,lower defectivity,metal-free conditioning disks,micro replicated conditioning disks,microreplicated pad conditioner,pad wear,size 22 nm,wafer uniformity,Diamonds,Rough surfaces,Standards,Surface morphology,Surface roughness,Surface topography,Surface treatment,Cu CMP,microreplication,pad conditioning
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    Low complexity cloud-video-mixing using HEVC

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date accessioned2020-03-12T20:22:37Z
date available2020-03-12T20:22:37Z
date issued2014
identifier other6866573.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1012258?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleLow complexity cloud-video-mixing using HEVC
typeConference Paper
contenttypeMetadata Only
identifier padid8135029
subject keywordsabrasives
subject keywordschemical mechanical polishing
subject keywordscopper
subject keywordswear
subject keywordsCu
subject keywordscopper barrier CMP applications
subject keywordslonger pad life time
subject keywordslower defectivity
subject keywordsmetal-free conditioning disks
subject keywordsmicro replicated conditioning disks
subject keywordsmicroreplicated pad conditioner
subject keywordspad wear
subject keywordssize 22 nm
subject keywordswafer uniformity
subject keywordsDiamonds
subject keywordsRough surfaces
subject keywordsStandards
subject keywordsSurface morphology
subject keywordsSurface roughness
subject keywordsSurface topography
subject keywordsSurface treatment
subject keywordsCu CMP
subject keywordsmicroreplication
subject keywordspad conditioning
identifier doi10.1109/ICPT.2014.7017269
journal titleonsumer Communications and Networking Conference (CCNC), 2014 IEEE 11th
filesize451166
citations0
contributor rawauthorSanchez, Y. , Globisch, R. , Schierl, T. , Wiegand, T.
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