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نمایش تعداد 1-6 از 6

Electrical-Thermal Co-Simulation of 3D Integrated Systems With Micro-Fluidic Cooling and Joule Heating Effects

نوع: Journal Paper

نویسنده : Jianyong Xie; Madhavan Swaminathan

سال: 2011

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Effect of via-transitions on signal integrity using power transmission lines

نوع: Journal Paper

نویسنده : David C. Zhang; Madhavan Swaminathan; David Keezer

سال: 2016

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Analysis and Design of Electromagnetic Bandgap (EBG) Structures for Power Plane Isolation Using 2D Dispersion Diagrams and Scalability

نوع: Journal Paper

نویسنده : A. Engin; Yoshitaka Toyota; Tae Kim; Madhavan Swaminathan

سال: 2006

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Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

نوع: Journal Paper

نویسنده : Jinwoo Choi; Dong Gun Kam; Daehyun Chung; Krishna Srinivasan; Vinu Govind; Joungho Kim; Madhavan Swaminathan

سال: 2007

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Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I

نوع: Journal Paper

نویسنده : Etienne Sicard; Wu Jianfei; R. J. Shen; Er-Ping Li; En-Xiao Liu; J. Kim; Jonghyun Cho; Madhavan Swaminathan

سال: 2015

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Recent advances in electromagnetic compatibility of 3D-ICs — Part II

نوع: Journal Paper

نویسنده : Etienne Sicard; Wu Jianfei; Rongjun Shen; Er-Ping Li; En-Xiao Liu; Joungho Kim; Jonghyun Cho; Madhavan Swaminathan

سال: 2016

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Electrical-Thermal Co-Simulation of 3D Integrated Systems With Micro-Fluidic Cooling and Joule Heating Effects

Effect of via-transitions on signal integrity using power transmission lines

Analysis and Design of Electromagnetic Bandgap (EBG) Structures for Power Plane Isolation Using 2D Dispersion Diagrams and Scalability

Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I

Recent advances in electromagnetic compatibility of 3D-ICs — Part II

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Electrical-Thermal Co-Simulation of 3D Integrated Systems With Micro-Fluidic Cooling and Joule Heating Effects

Effect of via-transitions on signal integrity using power transmission lines

Analysis and Design of Electromagnetic Bandgap (EBG) Structures for Power Plane Isolation Using 2D Dispersion Diagrams and Scalability

Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I

Recent advances in electromagnetic compatibility of 3D-ICs — Part II