Static thermal analyses for the earlier concept and the enhanced quasi-monolithic integration technology (QMIT) are performed in detail. The effects of several parameters such as the properties of the materials involved ...

In this paper, application of scanning probe microscopy (SPM) and nanometer surface profiler of DEKTAK for determination of thermal stress in standard structure of QMIT is described. A three dimension finite element (3DFE) ...

We report on the quasi-monolithic integration of unpackaged high-power AlGaN/GaN HEMTs into a silicon basis, which finally will be the backbone and main part of an integrated circuit. III/V compound semiconductor devices ...