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نمایش تعداد 1-6 از 6

Use of Doppler focusing to resolve spatial channels from moving platforms

نوع: Conference Paper

نویسنده : Linli Cui , Michelson, D.G.

ناشر: IEEE

سال: 2014

A new voltage-balancing method for split-capacitor inverters using split-output front-end rectifiers in AC-DC-AC applications

نوع: Conference Paper

نویسنده : Narimani, M. , Wijeratne, D. , Moschopoulos, G.

ناشر: IEEE

سال: 2014

Semantic based Web Prefetching using Decision Tree Induction

نوع: Conference Paper

نویسنده : Sharma, N.; Dubey, S.K.

ناشر: IEEE

سال: 2014

Supporting Privacy Protection in Personalized Web Search

نوع: Journal Paper

نویسنده : Lidan Shou; He Bai; Ke Chen; Gang Chen

ناشر: IEEE

سال: 2014

Assessment of public domain forecast products for predicting anomalous RF propagation

نوع: Conference Paper

نویسنده : Hanley, T.R.; Gehman, J.Z.; Giannola, R.M.

ناشر: IEEE

سال: 2014

Mechanical characterization of bond wire materials in electronic devices at elevated temperatures

نوع: Conference Paper

نویسنده : Lorenz, G.; Naumann, F.; Mittag, M.; Petzold, M.

ناشر: IEEE

سال: 2014

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Use of Doppler focusing to resolve spatial channels from moving platforms

A new voltage-balancing method for split-capacitor inverters using split-output front-end rectifiers in AC-DC-AC applications

Semantic based Web Prefetching using Decision Tree Induction

Supporting Privacy Protection in Personalized Web Search

Assessment of public domain forecast products for predicting anomalous RF propagation

Mechanical characterization of bond wire materials in electronic devices at elevated temperatures

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Use of Doppler focusing to resolve spatial channels from moving platforms

A new voltage-balancing method for split-capacitor inverters using split-output front-end rectifiers in AC-DC-AC applications

Semantic based Web Prefetching using Decision Tree Induction

Supporting Privacy Protection in Personalized Web Search

Assessment of public domain forecast products for predicting anomalous RF propagation

Mechanical characterization of bond wire materials in electronic devices at elevated temperatures