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نمایش تعداد 1-10 از 74
Low-cost on-chip structures for combating die and IC recycling
ناشر: IEEE
سال: 2014
On the Minimality and Uniqueness of the Bott–Duffin Realization Procedure
ناشر: IEEE
سال: 2014
Lumped Parameter Modeling for Thermal Characterization of High-Power Modules
ناشر: IEEE
سال: 2014
[Copyright notice]
ناشر: IEEE
سال: 2014
Generation and detection of OAM signals for radio communications
ناشر: IEEE
سال: 2014