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نمایش تعداد 1-10 از 530

Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration

نوع: Conference Paper

نویسنده : Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, A.; Dittrich, M.; Wolf, J.

ناشر: IEEE

سال: 2014

Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer

نوع: Conference Paper

نویسنده : Lim, Sharon Pei-Siang; Ding, Mian Zhi; Dexter Velez, Sorono; Cereno, Daniel Ismael; Lin, Jong Kai; Rao, Vempati Srinivasa

ناشر: IEEE

سال: 2014

Investigation of Alternative Evolutionary Prototype Generation in Medical Classification

نوع: Conference Paper

نویسنده : Stoean, Catalin; Stoean, Ruxandra; Sandita, Adrian

ناشر: IEEE

سال: 2014

Title Page iii

نوع: Conference Paper

ناشر: IEEE

سال: 2014

A study on low grid voltage problem near Rooppur nuclear power plant

نوع: Conference Paper

نویسنده : Chowdhury, A.Hasib; Rabby, Md.Khurram Monir

ناشر: IEEE

سال: 2014

Sinter paste for power packages

نوع: Conference Paper

نویسنده : Xin, Yong Ling

ناشر: IEEE

سال: 2014

Multioriented video scene based image dehazing using artificial bee colony optimization

نوع: Conference Paper

نویسنده : Chitra, S.; Raja, M.Arokia Irudaya

ناشر: IEEE

سال: 2014

Enforcing adaptive user modeling using ontology

نوع: Conference Paper

نویسنده : Potey, Madhuri A.; Sadafule, Rajashri S.; Sinha, P.K.

ناشر: IEEE

سال: 2014

Business regulation for consumer welfare- consumer protection in India, related to marketing

نوع: Conference Paper

نویسنده : Agasti, Sarmistha; Sengupta, Partha Pratim

ناشر: IEEE

سال: 2014

Development and performance analysis of a two-phase induction motor in the frame and core of a single-phase induction motor

نوع: Conference Paper

نویسنده : Khan, Md Ayubur Rahman; Ahsan, Md Quamrul

ناشر: IEEE

سال: 2014

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Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration

Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer

Investigation of Alternative Evolutionary Prototype Generation in Medical Classification

Title Page iii

A study on low grid voltage problem near Rooppur nuclear power plant

Sinter paste for power packages

Multioriented video scene based image dehazing using artificial bee colony optimization

Enforcing adaptive user modeling using ontology

Business regulation for consumer welfare- consumer protection in India, related to marketing

Development and performance analysis of a two-phase induction motor in the frame and core of a single-phase induction motor

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Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration

Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer

Investigation of Alternative Evolutionary Prototype Generation in Medical Classification

Title Page iii

A study on low grid voltage problem near Rooppur nuclear power plant

Sinter paste for power packages

Multioriented video scene based image dehazing using artificial bee colony optimization

Enforcing adaptive user modeling using ontology

Business regulation for consumer welfare- consumer protection in India, related to marketing

Development and performance analysis of a two-phase induction motor in the frame and core of a single-phase induction motor