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نمایش تعداد 1-10 از 15

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

نوع: Journal Paper

نویسنده : Navarro, Luis /A/.; Perpina, Xavier; Godignon, P.; Montserrat, J.; Banu, V.; Vellvehi, Miquel; Jorda, Xavier

ناشر: IEEE

سال: 2014

High Precision Multicolorimetric Pyrometer With a Novel Photoelectric MOSFET

نوع: Journal Paper

نویسنده : Sheng Chang; Qijun Huang; Hao Wang; Mincai He; Feng Dai

ناشر: IEEE

سال: 2014

A High Density 250<inline-formula> <img src="/images/tex/21629.gif" alt="^{\\circ}{\\rm C}"> </inline-formula> Junction Temperature SiC Power Module Development

نوع: Journal Paper

نویسنده : Puqi Ning; Fei Wang; Di Zhang

ناشر: IEEE

سال: 2014

Core Mode-Cladding Supermode Modal Interferometer and High-Temperature Sensing Application Based on All-Solid Photonic Bandgap Fiber

نوع: Journal Paper

نویسنده : Tan, Xiao Liang; Geng, Y.F.; Li, X.J.; Yu, Y.Q.; Deng, Y.L.; Yin, Zheng; Gao, Ran

ناشر: IEEE

سال: 2014

A hot prospect

نوع: Journal Paper

ناشر: IET

سال: 2014

A novel architecture of ontology mapping system for Hidden Web Retrieval

نوع: Conference Paper

نویسنده : Manvi , Dixit, A. , Bhatia, K.K. , Mishra, R.

ناشر: IEEE

سال: 2014

Heat distribution mathematical model and numerical simulation of an electric oven

نوع: Conference Paper

نویسنده : Luo Xuan , Cui Guozhong , Le Fulong

ناشر: IEEE

سال: 2014

GIROFLOW: Openflow virtualized infrastructure management tool

نوع: Conference Paper

نویسنده : Do Nascimento Araujo, T.; Moreira Salles, R.

ناشر: IEEE

سال: 2014

Silicon Carbide Integrated Circuits With Stable Operation Over a Wide Temperature Range

نوع: Journal Paper

نویسنده : Ghandi, Reza; Cheng-Po Chen; Liang Yin; Xingguang Zhu; Liangchun Yu; Arthur, Stephen; Ahmad, Farhan; Sandvik, Peter

ناشر: IEEE

سال: 2014

A Novel Collision Avoidance Algorithm for IEEE 802.11 Wireless LANs

نوع: Conference Paper

نویسنده : Cheng, Hongwei; Yan, Xiao; Lian, Hao; Weng, Lina; Zhang, Qixun; Feng, Zhiyong

ناشر: IEEE

سال: 2014

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Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

High Precision Multicolorimetric Pyrometer With a Novel Photoelectric MOSFET

A High Density 250<inline-formula> <img src="/images/tex/21629.gif" alt="^{\\circ}{\\rm C}"> </inline-formula> Junction Temperature SiC Power Module Development

Core Mode-Cladding Supermode Modal Interferometer and High-Temperature Sensing Application Based on All-Solid Photonic Bandgap Fiber

A hot prospect

A novel architecture of ontology mapping system for Hidden Web Retrieval

Heat distribution mathematical model and numerical simulation of an electric oven

GIROFLOW: Openflow virtualized infrastructure management tool

Silicon Carbide Integrated Circuits With Stable Operation Over a Wide Temperature Range

A Novel Collision Avoidance Algorithm for IEEE 802.11 Wireless LANs

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Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

High Precision Multicolorimetric Pyrometer With a Novel Photoelectric MOSFET

A High Density 250<inline-formula> <img src="/images/tex/21629.gif" alt="^{\\circ}{\\rm C}"> </inline-formula> Junction Temperature SiC Power Module Development

Core Mode-Cladding Supermode Modal Interferometer and High-Temperature Sensing Application Based on All-Solid Photonic Bandgap Fiber

A hot prospect

A novel architecture of ontology mapping system for Hidden Web Retrieval

Heat distribution mathematical model and numerical simulation of an electric oven

GIROFLOW: Openflow virtualized infrastructure management tool

Silicon Carbide Integrated Circuits With Stable Operation Over a Wide Temperature Range

A Novel Collision Avoidance Algorithm for IEEE 802.11 Wireless LANs