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نمایش تعداد 1-10 از 10

Drop Impact Reliability Analysis of 3-D Chip-on-Chip Packaging: Numerical Modeling and Experimental Validation

نوع: Journal Paper

نویسنده : Hsien-Chie Cheng; Hsin-Kai Cheng; Su-Tsai Lu; Jing-Ye Juang; Wen-Hwa Chen

ناشر: IEEE

سال: 2014

Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs

نوع: Journal Paper

نویسنده : Li-Ren Huang; Shi-Yu Huang; Kun-Han Tsai; Wu-Tung Cheng

ناشر: IEEE

سال: 2014

Combined Source Adaptive and Channel Optimized Matrix Quantization algorithm

نوع: Conference Paper

نویسنده : Bozantzis, V. , Philippopoulos, P.

ناشر: IEEE

سال: 2014

Pulsewidth modulated controller integrated circuit: Four decades of progress [A Look Back]

نوع: Journal Paper

نویسنده : Bindra, Ashok

ناشر: IEEE

سال: 2014

A Circuit Model for the Design of Self-Excited EBG Resonator Antennas With Miniaturized Unit Cells

نوع: Journal Paper

نویسنده : Hosseini, Mahmood; Klymyshyn, David M.; Wells, Garth

ناشر: IEEE

سال: 2014

A Semianalytical Model for Vias With Arbitrarily Shaped Antipads Based on the Reciprocity Theorem

نوع: Journal Paper

نویسنده : Xichen Guo; Jackson, David R.; Ji Chen

ناشر: IEEE

سال: 2014

Patch antenna array for IEEE 802.11b/g/n MIMO application

نوع: Conference Paper

نویسنده : Chang, Dau-Chyrh; Yen, Ming-Ching; Tsai, Yau-Jyun; Kao, Chang-Hsuan; Lee, Chih-Hung

ناشر: IEEE

سال: 2014

Privacy-preserving biometrics using matrix random low-rank approximation approach

نوع: Conference Paper

نویسنده : Xi Chen; Luping Zheng; Zengli Liu; Jiashu Zhang

ناشر: IEEE

سال: 2014

Adaptive automatic segmentation of leishmaniasis parasite in indirect immunofluorescence images

نوع: Conference Paper

نویسنده : Ouertani, F.; Amiri, H.; Bettaib, J.; Yazidi, R.; Ben Salah, A.

ناشر: IEEE

سال: 2014

A Low-Loss and High Isolation D-Band SPDT Switch Utilizing Deep-Saturated SiGe HBTs

نوع: Journal Paper

نویسنده : Ulusoy, /A/. Cagri; Song, Peter; Schmid, Robert L.; Khan, Wasif T.; Kaynak, Mehmet; Tillack, Bernd; Papapolymerou, John; Cressler, John D.

ناشر: IEEE

سال: 2014

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Drop Impact Reliability Analysis of 3-D Chip-on-Chip Packaging: Numerical Modeling and Experimental Validation

Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs

Combined Source Adaptive and Channel Optimized Matrix Quantization algorithm

Pulsewidth modulated controller integrated circuit: Four decades of progress [A Look Back]

A Circuit Model for the Design of Self-Excited EBG Resonator Antennas With Miniaturized Unit Cells

A Semianalytical Model for Vias With Arbitrarily Shaped Antipads Based on the Reciprocity Theorem

Patch antenna array for IEEE 802.11b/g/n MIMO application

Privacy-preserving biometrics using matrix random low-rank approximation approach

Adaptive automatic segmentation of leishmaniasis parasite in indirect immunofluorescence images

A Low-Loss and High Isolation D-Band SPDT Switch Utilizing Deep-Saturated SiGe HBTs

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Drop Impact Reliability Analysis of 3-D Chip-on-Chip Packaging: Numerical Modeling and Experimental Validation

Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs

Combined Source Adaptive and Channel Optimized Matrix Quantization algorithm

Pulsewidth modulated controller integrated circuit: Four decades of progress [A Look Back]

A Circuit Model for the Design of Self-Excited EBG Resonator Antennas With Miniaturized Unit Cells

A Semianalytical Model for Vias With Arbitrarily Shaped Antipads Based on the Reciprocity Theorem

Patch antenna array for IEEE 802.11b/g/n MIMO application

Privacy-preserving biometrics using matrix random low-rank approximation approach

Adaptive automatic segmentation of leishmaniasis parasite in indirect immunofluorescence images

A Low-Loss and High Isolation D-Band SPDT Switch Utilizing Deep-Saturated SiGe HBTs