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نمایش تعداد 1-10 از 202

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Demonstrating Energy-Efficiency Improvements in Load-Adaptive Dynamic Multilayer Optical Networks

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Temperature modeling and simulation of the asphaltic emulsion in an industrial tank

نوع: Conference Paper

نویسنده : Muresan, V. , Abrudean, M. , Colosi, T.

ناشر: IEEE

سال: 2014

Data-driven Model-Free Adaptive Control of twin rotor aerodynamic systems

نوع: Conference Paper

نویسنده : Roman, R.-C. , Radac, M.-B. , Precup, R.-E.

ناشر: IEEE

سال: 2014

Development of mechanical measurement system applied for electroplastic effect research

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Integration of plug-in electric vehicles in power systems using charging mode switching

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Recent development and future prospects of power SiC devices

نوع: Conference Paper

نویسنده : Nakamura, T. , Nakano, Y. , Aketa, M. , Hanada, T.

ناشر: IEEE

سال: 2014

Wafer level warpage characterization for backside manufacturing processes of TSV interposers

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Proposal and Evaluation of Safe and Efficient Log Signature Scheme for the Preservation of Evidence

نوع: Conference Paper

نویسنده : Kobayashi, N. , Sasaki, R.

ناشر: IEEE

سال: 2014

Development of a learning system for proving the congruence of two triangles by supporting ‘backward chaining’

نوع: Conference Paper

نویسنده : Onda, R.; Hirai, Y.; Kaneko, K.

ناشر: IEEE

سال: 2014

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Demonstrating Energy-Efficiency Improvements in Load-Adaptive Dynamic Multilayer Optical Networks

Temperature modeling and simulation of the asphaltic emulsion in an industrial tank

Data-driven Model-Free Adaptive Control of twin rotor aerodynamic systems

Development of mechanical measurement system applied for electroplastic effect research

Integration of plug-in electric vehicles in power systems using charging mode switching

Recent development and future prospects of power SiC devices

Wafer level warpage characterization for backside manufacturing processes of TSV interposers

Proposal and Evaluation of Safe and Efficient Log Signature Scheme for the Preservation of Evidence

Development of a learning system for proving the congruence of two triangles by supporting ‘backward chaining’

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Table of contents

Demonstrating Energy-Efficiency Improvements in Load-Adaptive Dynamic Multilayer Optical Networks

Temperature modeling and simulation of the asphaltic emulsion in an industrial tank

Data-driven Model-Free Adaptive Control of twin rotor aerodynamic systems

Development of mechanical measurement system applied for electroplastic effect research

Integration of plug-in electric vehicles in power systems using charging mode switching

Recent development and future prospects of power SiC devices

Wafer level warpage characterization for backside manufacturing processes of TSV interposers

Proposal and Evaluation of Safe and Efficient Log Signature Scheme for the Preservation of Evidence

Development of a learning system for proving the congruence of two triangles by supporting &#x2018;backward chaining&#x2019;

Development of a learning system for proving the congruence of two triangles by supporting ‘backward chaining’