Search

نمایش تعداد 1-10 از 81

Piezoresistive cantilever platform for label-free detection of molecules

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Research on dynamic characteristics and countermeasures of AC-DC hybrid power system with large scale HVDC transmission

نوع: Conference Paper

نویسنده : Jingbo, He; Mingjie, Li; Jun, Yi; Qing, Chang; Tao, Xu; Zhao, Yu

ناشر: IEEE

سال: 2014

High-Yield Fabrication Process for 3D-Stacked Ultrathin Chip Packages Using Photo-Definable Polyimide and Symmetry in Packages

نوع: Journal Paper

نویسنده : Priyabadini, Swarnakamal; Sterken, Tom; Cauwe, Maarten; Van Hoorebeke, Luc; Vanfleteren, Jan

ناشر: IEEE

سال: 2014

A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories

نوع: Journal Paper

نویسنده : Hyungsu Sung; Keewon Cho; Kunsang Yoon; Sungho Kang

ناشر: IEEE

سال: 2014

Suppression of Read Disturb Fail Caused by Boosting Hot Carrier Injection Effect for 3-D Stack NAND Flash Memories

نوع: Journal Paper

نویسنده : Byeong-In Choe; Jung-Kyu Lee; Byung-Gook Park; Jong-Ho Lee

ناشر: IEEE

سال: 2014

Analysis of the effects of rain on surface wind retrieval from X-band marine radar images

نوع: Conference Paper

نویسنده : Liu, Ying; Huang, Weimin; Gill, Eric W.

ناشر: IEEE

سال: 2014

Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

نوع: Journal Paper

نویسنده : Liu, Zhe; Swarup, Samarth; Tan, Sheldon X.-D; Chen, Hong-Bin; Wang, Huifang

ناشر: IEEE

سال: 2014

Exploring Silicon Nanophotonics in Throughput Architecture

نوع: Journal Paper

نویسنده : Goswami, Nilanjan; Zhongqi Li; Shankar, Raji; Tao Li

ناشر: IEEE

سال: 2014

A 3-D Stacked High-<inline-formula> <img src="/images/tex/18865.gif" alt="Q"> </inline-formula> PI-Based MEMS Inductor for Wireless Power Transmission System in Bio-Implanted Applications

نوع: Journal Paper

نویسنده : Xuming Sun; Xuhua Peng; Yang Zheng; Xiuhan Li; Haixia Zhang

ناشر: IEEE

سال: 2014

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

نوع: Conference Paper

نویسنده : Liang Jiang; Yongyong He; Xinchun Lu; Jianbin Luo

ناشر: IEEE

سال: 2014

1
2
3
4
. . .
9

Search

Piezoresistive cantilever platform for label-free detection of molecules

Research on dynamic characteristics and countermeasures of AC-DC hybrid power system with large scale HVDC transmission

High-Yield Fabrication Process for 3D-Stacked Ultrathin Chip Packages Using Photo-Definable Polyimide and Symmetry in Packages

A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories

Suppression of Read Disturb Fail Caused by Boosting Hot Carrier Injection Effect for 3-D Stack NAND Flash Memories

Analysis of the effects of rain on surface wind retrieval from X-band marine radar images

Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

Exploring Silicon Nanophotonics in Throughput Architecture

A 3-D Stacked High-<inline-formula> <img src="/images/tex/18865.gif" alt="Q"> </inline-formula> PI-Based MEMS Inductor for Wireless Power Transmission System in Bio-Implanted Applications

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

نویسنده

ناشر

سال

کلیدواژه

نوع

زبان

نوع محتوا

عنوان ناشر

Search

Filters

Piezoresistive cantilever platform for label-free detection of molecules

Research on dynamic characteristics and countermeasures of AC-DC hybrid power system with large scale HVDC transmission

High-Yield Fabrication Process for 3D-Stacked Ultrathin Chip Packages Using Photo-Definable Polyimide and Symmetry in Packages

A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories

Suppression of Read Disturb Fail Caused by Boosting Hot Carrier Injection Effect for 3-D Stack NAND Flash Memories

Analysis of the effects of rain on surface wind retrieval from X-band marine radar images

Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

Exploring Silicon Nanophotonics in Throughput Architecture

A 3-D Stacked High-<inline-formula> <img src="/images/tex/18865.gif" alt="Q"> </inline-formula> PI-Based MEMS Inductor for Wireless Power Transmission System in Bio-Implanted Applications

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer