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Microsystem integration using hybrid microassembly
Publisher: IEEE
Year: 2014
Study in Usefulness of Middleware-Only Provenance
Publisher: IEEE
Year: 2014
Authoritative Scholarly Paper Recommendation Based on Paper Communities
Publisher: IEEE
Year: 2014
Explicit constructions for type-1 QC-LDPC codes with girth at least ten
Publisher: IEEE
Year: 2014
Effect of thermal ageing on space charge characteristics of cross-linked polyethylene
Publisher: IEEE
Year: 2014