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Hermetic packaging of Kovar alloy and low-carbon steel structure in hybrid integrated circuit (HIC) system using parallel seam welding process

Type: Conference Paper

Author : Junde Wang; Xiaoqi He; Xunping Li; Yunfei En; Xinping Zhang

Publisher: IEEE

Year: 2014

Data analysis method of the small samples and zero-failure data for space TWT accelerated life test

Type: Conference Paper

Author : Fangfang Song; Zhenwei Zhou; Shajin Li; Yunfei En; Bin Li

Publisher: IEEE

Year: 2014

Total-Ionizing-Dose Induced Coupling Effect in the 130-nm PDSOI I/O nMOSFETs

Type: Journal Paper

Author : Chao Peng; Zhiyuan Hu; Bingxu Ning; Huixiang Huang; Zhengxuan Zhang; Dawei Bi; Yunfei En; Shichang Zou

Publisher: IEEE

Year: 2014

Investigation of Threshold Ion Range for Accurate Single Event Upset Measurements in Both SOI and Bulk Technologies

Type: Journal Paper

Author : Zhangang Zhang; Jie Liu; Mingdong Hou; Song Gu; Tianqi Liu; Fazhan Zhao; Chao Geng; Kai Xi; Youmei Sun; Huijun Yao; Jie Luo; Jinglai Duan; Dan Mo; Gang Liu; Zhengsheng Han; Yunfei En

Publisher: IEEE

Year: 2014

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Hermetic packaging of Kovar alloy and low-carbon steel structure in hybrid integrated circuit (HIC) system using parallel seam welding process

Data analysis method of the small samples and zero-failure data for space TWT accelerated life test

Total-Ionizing-Dose Induced Coupling Effect in the 130-nm PDSOI I/O nMOSFETs

Investigation of Threshold Ion Range for Accurate Single Event Upset Measurements in Both SOI and Bulk Technologies

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Hermetic packaging of Kovar alloy and low-carbon steel structure in hybrid integrated circuit (HIC) system using parallel seam welding process

Data analysis method of the small samples and zero-failure data for space TWT accelerated life test

Total-Ionizing-Dose Induced Coupling Effect in the 130-nm PDSOI I/O nMOSFETs

Investigation of Threshold Ion Range for Accurate Single Event Upset Measurements in Both SOI and Bulk Technologies