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A semi-analytical model for dense via structures with shared antipad configurations
Publisher: IEEE
Year: 2014
Fast electromagnetic modeling of massively coupled vias in 3-D interconnects
Publisher: IEEE
Year: 2014
A Semianalytical Model for Vias With Arbitrarily Shaped Antipads Based on the Reciprocity Theorem
Publisher: IEEE
Year: 2014
An Analysis of Conductor Surface Roughness Effects on Signal Propagation for Stripline Interconnects
Publisher: IEEE
Year: 2014