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Now showing items 1-6 of 6
Sensor-to-Digital Interface Built Entirely With Carbon Nanotube FETs
Publisher: IEEE
Year: 2014
Monolithic 3D integration advances and challenges: From technology to system levels
Publisher: IEEE
Year: 2014
The Role of Ti Capping Layer in HfO<sub><italic>x</italic></sub>-Based RRAM Devices
Publisher: IEEE
Year: 2014