Search

Now showing items 1-10 of 13

Finite-time leader-following consensus for multiple non-holonomic agents

Type: Conference Paper

Author : Jiankui Wang , Teng Gao , Guoshan Zhang

Publisher: IEEE

Year: 2014

Divergence-based feature selection for separate classes

Type: Journal Paper

Author : Zhang, Yishi; Li, Shujuan; Wang, Teng; Zhang, Zigang

Publisher: Elsevier Science

Year: 2013

Request PDF

Improved Single-Stream Beamforming Algorithm in TD-LTE System

Type: Conference Paper

Author : Liu, Yanan; Liu, Hao; Jia, Tianxiang; Wang, Teng

Publisher: IEEE

Year: 2014

Case study on the model for logistics capability evaluation and optimization based on a key node of logistics network

Type: Conference Paper

Author : Li Hong; Yuan Meng; Wang Teng; Xu Desheng

Publisher: IEEE

Year: 2014

Electronic and elastic properties of MoS2

Type: Journal Paper

Author : Li Wei; Chen Jun-fang; He Qinyu; Wang Teng

Year: 2010

Request PDF

Through silicon vias filled with planarized carbon nanotube bundles

Type: Journal Paper

Author : Wang, Teng; Jeppson, Kjell; Olofsson, Niklas; Campbell, Eleanor E B; Liu, Johan

Year: 2009

Request PDF

BurstMem: A high-performance burst buffer system for scientific applications

Type: Conference Paper

Author : Wang, Teng; Oral, Sarp; Wang, Yandong; Settlemyer, Brad; Atchley, Scott; Yu, Weikuan

Publisher: IEEE

Year: 2014

Temperature-Controlled Electrochemical Switch Based on Layered Double Hydroxide/Poly( N -Isopropylacrylamide) Ultrathin Films Fabricated via Layer-by-Layer Assembly

Type: Journal Paper

Author : Dou, Yibo; Han, Jingbin; Wang, Tengli; Wei, Min; Evans, David G.; Duan, Xue

Year: 2012

Request PDF

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Type: Journal Paper

Author : Fu, Yifeng; Nabiollahi, Nabi; Wang, Teng; Wang, Shun; Hu, Zhili; Carlberg, Bjö rn; Zhang, Yan; Wang, Xiaojing; Liu, Johan

Year: 2012

Request PDF

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Type: Conference Paper

Author : Wang, Teng; Daily, Robert; Capuz, Giovanni; Gerets, Carine; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric

Publisher: IEEE

Year: 2014

Search

Finite-time leader-following consensus for multiple non-holonomic agents

Divergence-based feature selection for separate classes

Improved Single-Stream Beamforming Algorithm in TD-LTE System

Case study on the model for logistics capability evaluation and optimization based on a key node of logistics network

Electronic and elastic properties of MoS2

Through silicon vias filled with planarized carbon nanotube bundles

BurstMem: A high-performance burst buffer system for scientific applications

Temperature-Controlled Electrochemical Switch Based on Layered Double Hydroxide/Poly( N -Isopropylacrylamide) Ultrathin Films Fabricated via Layer-by-Layer Assembly

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Finite-time leader-following consensus for multiple non-holonomic agents

Divergence-based feature selection for separate classes

Improved Single-Stream Beamforming Algorithm in TD-LTE System

Case study on the model for logistics capability evaluation and optimization based on a key node of logistics network

Electronic and elastic properties of MoS2

Through silicon vias filled with planarized carbon nanotube bundles

BurstMem: A high-performance burst buffer system for scientific applications

Temperature-Controlled Electrochemical Switch Based on Layered Double Hydroxide/Poly( N -Isopropylacrylamide) Ultrathin Films Fabricated via Layer-by-Layer Assembly

A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs