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Now showing items 1-4 of 4
Effect of process technology variation on ESD clamp parameters
Publisher: IEEE
Year: 2014
Modeling of the test-fixture / Horizontal Coupling Plane interaction in system-level ESD test setups
Publisher: IEEE
Year: 2014
Correlation Between TLP, HMM, and System-Level ESD Pulses for Cu Metallization
Publisher: IEEE
Year: 2014
Miscorrelation Between Air Gap Discharge and Human Metal Model Stresses Due to Multi-Finger Turn-On Effect
Publisher: IEEE
Year: 2014