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Now showing items 1-7 of 7

A comparative reliability study of copper-plated glass vias, drilled with CO<inf>2</inf> and ArF excimer lasers

Type: Conference Paper

Author : Broas, Mikael; Demir, Kaya; Sato, Yoichiro; Sundaram, Venkatesh; Tummala, Rao

Publisher: IEEE

Year: 2014

Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections

Type: Journal Paper

Author : Xian Qin; Kumbhat, Nitesh; Raj, P. Markondeya; Sundaram, Venky; Tummala, Rao

Publisher: IEEE

Year: 2014

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Type: Conference Paper

Author : Kim, Youngwoo; Cho, Kiyeong Kim Jonghyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao

Publisher: IEEE

Year: 2014

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

Type: Journal Paper

Author : Qiao Chen; Xi Liu; Sundaram, Venky; Sitaraman, Suresh K.; Tummala, Rao R.

Publisher: IEEE

Year: 2014

Ultraminiaturized WLAN RF Receiver Module in Thin Organic Substrate

Type: Journal Paper

Author : Sitaraman, Srikrishna; Suzuki, Yuya; Fuhan Liu; Kumbhat, Nitesh; Sung Jin Kim; Sundaram, Venky; Tummala, Rao

Publisher: IEEE

Year: 2014

Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics

Type: Conference Paper

Author : Raj, P.Markondeya; Chakraborti, Parthasarathi; Sharma, Himani; Han, KyuHwan; Gandhi, Saumya; Sitaraman, Srikrishna; Swaminathan, Madhavan; Tummala, Rao

Publisher: IEEE

Year: 2014

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

Type: Journal Paper

Author : Sukumaran, Vijay; Kumar, Girish; Ramachandran, Kishore; Suzuki, Yuya; Demir, Kubilay; Sato, Yuuki; Seki, Takaya; Sundaram, Venky; Tummala, Rao R.

Publisher: IEEE

Year: 2014

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A comparative reliability study of copper-plated glass vias, drilled with CO<inf>2</inf> and ArF excimer lasers

Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

Ultraminiaturized WLAN RF Receiver Module in Thin Organic Substrate

Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

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A comparative reliability study of copper-plated glass vias, drilled with CO<inf>2</inf> and ArF excimer lasers

Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

Ultraminiaturized WLAN RF Receiver Module in Thin Organic Substrate

Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon