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Now showing items 1-7 of 7
Managing signal, power and thermal integrity for 3D integration
Publisher: IEEE
Year: 2014
System-Level Thermal Modeling Using Nonconformal Domain Decomposition and Model-Order Reduction
Publisher: IEEE
Year: 2014
FDFD Modeling of Signal Paths With TSVs in Silicon Interposer
Publisher: IEEE
Year: 2014
Modeling of Power/Ground Planes Using Triangular Elements
Publisher: IEEE
Year: 2014
Efficient computation of capacitive coupling between planar and cylindrical interconnections
Publisher: IEEE
Year: 2014
Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics
Publisher: IEEE
Year: 2014