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Manufacturing of 3D integrated sensors and circuits

Type: Conference Paper

Author : Schrems, M.; Siegert, J.; Dorfi, P.; Kraft, J.; Stueckler, E.; Schrank, F.; Selberherr, S.

Publisher: IEEE

Year: 2014

Through Silicon Via Reliability

Type: Journal Paper

Author : Cassidy, C.; Kraft, J.; Carniello, S.; Roger, F.; Ceric, H.; Singulani, A.P.; Langer, E.; Schrank, F.

Publisher: IEEE

Year: 2012

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Bimetallic nanoparticles for optimizing CMOS integrated SnO<inf>2</inf> gas sensor devices

Type: Conference Paper

Author : Mutinati, G.C.; Brunet, E.; Yurchenko, O.; Laubender, E.; Urban, G.; Koeck, A.; Steinhauer, S.; Siegert, J.; Rohracher, K.; Schrank, F.; Schrems, M.

Publisher: IEEE

Year: 2014

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Manufacturing of 3D integrated sensors and circuits

Through Silicon Via Reliability

Bimetallic nanoparticles for optimizing CMOS integrated SnO<inf>2</inf> gas sensor devices

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Manufacturing of 3D integrated sensors and circuits

Through Silicon Via Reliability

Bimetallic nanoparticles for optimizing CMOS integrated SnO<inf>2</inf> gas sensor devices