Search

Now showing items 1-5 of 5

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Type: Conference Paper

Author : Wang, Teng; Daily, Robert; Capuz, Giovanni; Gerets, Carine; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric

Publisher: IEEE

Year: 2014

Cost components for 3D system integration

Type: Conference Paper

Author : Velenis, Dimitrios; Detalle, Mikael; Van Huylenbroeck, Stefaan; Jourdain, Anne; Phommahaxay, Alain; Slabbekoorn, John; Wang, Teng; Marinissen, Erik Jan; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric

Publisher: IEEE

Year: 2014

Room temperature and zero pressure high quality oxide direct bonding for 3D self-aligned assembly

Type: Conference Paper

Author : Dubey, Vikas; Van Huylenbroeck, Stefaan; Tutunjyan, Nina; Slabbekoorn, John; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Celis, Jean Pierre; Croes, Kristof; Beyne, Eric

Publisher: IEEE

Year: 2014

Picking large thinned dies with high topography on both sides

Type: Conference Paper

Author : Gerets, Carine; Derakhshandeh, Jaber; Wang, Teng; Capuz, Giovanni; Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric

Publisher: IEEE

Year: 2014

Reflow process optimization for micro-bumps applications in 3D technology

Type: Conference Paper

Author : Derakhshandeh, Jaber; De Preter, Inge; England, Luke; Schmid, Daniel; Slabbekoorn, John; Vakanas, George; Wang, Teng; Beyer, Gerald; Beyne, Eric; Marinissen, Erik Jan; Rebibis, Kenneth June; Lerch, Wilfried; Miller, Andy

Publisher: IEEE

Year: 2014

Search

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Cost components for 3D system integration

Room temperature and zero pressure high quality oxide direct bonding for 3D self-aligned assembly

Picking large thinned dies with high topography on both sides

Reflow process optimization for micro-bumps applications in 3D technology

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Cost components for 3D system integration

Room temperature and zero pressure high quality oxide direct bonding for 3D self-aligned assembly

Picking large thinned dies with high topography on both sides

Reflow process optimization for micro-bumps applications in 3D technology