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Flip-chip interconnects based on solution deposited carbon nanotube bumps

Type: Conference Paper

Author : Pingye Xu , Hamilton, M.C.

Publisher: IEEE

Year: 2014

Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects

Type: Journal Paper

Author : Pingye Xu; Pfeiffenberger, Alexander H.; Ellis, Charles D.; Hamilton, Michael C.

Publisher: IEEE

Year: 2014

Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

Type: Journal Paper

Author : Pingye Xu; Fei Tong; Davis, Virginia /A/.; Minseo Park; Hamilton, Michael C.

Publisher: IEEE

Year: 2014

High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-Doping

Type: Journal Paper

Author : Modic, Aaron; Gang Liu; Ahyi, Ayayi C.; Yuming Zhou; Pingye Xu; Hamilton, Michael C.; Williams, John R.; Feldman, L.C.; Dhar, Sudipta

Publisher: IEEE

Year: 2014

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Flip-chip interconnects based on solution deposited carbon nanotube bumps

Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects

Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-Doping

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Flip-chip interconnects based on solution deposited carbon nanotube bumps

Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical Interconnects

Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-Doping