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Now showing items 1-10 of 10

Development of epoxy-aluminum nanocomposite dielectric material with low filler concentration for embedded capacitor applications

Type: Journal Paper

Author : Paul, Sudipta; Sindhu, T.K.

Publisher: IEEE

Year: 2014

Synthesis and characterization of epoxy-aluminum nanocomposites for energy storage applications

Type: Journal Paper

Author : Paul, Sudipta; Sindhu, T.K.

Publisher: IEEE

Year: 2014

Importance of Voltage Reduction and Optimal Voltage Setting During Reactive Power Compensation

Type: Journal Paper

Author : Paul, Sudipta; Jewell, Ward T.

Publisher: IEEE

Year: 2014

Integration Without Disruption: The Basic Challenge of Sensor Integration

Type: Journal Paper

Author : Dumstorff, Gerrit; Paul, Sudipta; Lang, Walter

Publisher: IEEE

Year: 2014

A Variation-Aware Preferential Design Approach for Memory-Based Reconfigurable Computing

Type: Journal Paper

Author : Paul, Sudipta; Mukhopadhyay, Saibal; Bhunia, Swarup

Publisher: IEEE

Year: 2014

3-D Steady-State Eddy-Current Damping and Stiffness Terms for a Finite Thickness Conductive Plate

Type: Journal Paper

Author : Paul, Sudipta; Wright, John; Bird, Jonathan Z.

Publisher: IEEE

Year: 2014

A Survey of Energy Efficiency in Buildings and Microgrids using Networking Technologies

Type: Journal Paper

Author : Jianli Pan; Jain, R.; Paul, Sudipta

Publisher: IEEE

Year: 2014

Improving Energy Efficiency in FPGA Through Judicious Mapping of Computation to Embedded Memory Blocks

Type: Journal Paper

Author : Ghosh, A.; Paul, Sudipta; Park, Jongho; Bhunia, Swarup

Publisher: IEEE

Year: 2014

Barrier height control of metal/n-In<inf>0.2</inf>Ga<inf>0.8</inf>N with an ultrathin interfacial layer

Type: Conference Paper

Author : Paul, Sudipta; Hasan, Md.Soyaeb; Islam, Md.Rafiqul

Publisher: IEEE

Year: 2014

3-D Eddy Current Torque Modeling

Type: Journal Paper

Author : Paul, Sudipta; Bomela, Walter; Paudel, Naba; Bird, Jonathan Z.

Publisher: IEEE

Year: 2014

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Development of epoxy-aluminum nanocomposite dielectric material with low filler concentration for embedded capacitor applications

Synthesis and characterization of epoxy-aluminum nanocomposites for energy storage applications

Importance of Voltage Reduction and Optimal Voltage Setting During Reactive Power Compensation

Integration Without Disruption: The Basic Challenge of Sensor Integration

A Variation-Aware Preferential Design Approach for Memory-Based Reconfigurable Computing

3-D Steady-State Eddy-Current Damping and Stiffness Terms for a Finite Thickness Conductive Plate

A Survey of Energy Efficiency in Buildings and Microgrids using Networking Technologies

Improving Energy Efficiency in FPGA Through Judicious Mapping of Computation to Embedded Memory Blocks

Barrier height control of metal/n-In<inf>0.2</inf>Ga<inf>0.8</inf>N with an ultrathin interfacial layer

3-D Eddy Current Torque Modeling

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Development of epoxy-aluminum nanocomposite dielectric material with low filler concentration for embedded capacitor applications

Synthesis and characterization of epoxy-aluminum nanocomposites for energy storage applications

Importance of Voltage Reduction and Optimal Voltage Setting During Reactive Power Compensation

Integration Without Disruption: The Basic Challenge of Sensor Integration

A Variation-Aware Preferential Design Approach for Memory-Based Reconfigurable Computing

3-D Steady-State Eddy-Current Damping and Stiffness Terms for a Finite Thickness Conductive Plate

A Survey of Energy Efficiency in Buildings and Microgrids using Networking Technologies

Improving Energy Efficiency in FPGA Through Judicious Mapping of Computation to Embedded Memory Blocks

Barrier height control of metal/n-In<inf>0.2</inf>Ga<inf>0.8</inf>N with an ultrathin interfacial layer

3-D Eddy Current Torque Modeling