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Damage Evaluation of Wet-Chemical Si-Wafer Thinning/Backside Via Exposure Process

Type: Journal Paper

Author : Watanabe, N.; Miyazaki, Toshimasa; Yoshikawa, Kenichi; Aoyagi, Masahiro

Publisher: IEEE

Year: 2014

Fine-grained resource allocation for cooperative device-to-device communication in cellular networks

Type: Journal Paper

Author : Peng Li; Song Guo; Miyazaki, Toshimasa; Weihua Zhuang

Publisher: IEEE

Year: 2014

Final state control based on high-speed positioning control considering acceleration and speed limits for industrial robot

Type: Conference Paper

Author : Yabuki, Akinori; Nguyen, Hien; Yoshioka, Takashi; Ohishi, Kiyoshi; Miyazaki, Toshimasa; Yokokura, Yuki

Publisher: IEEE

Year: 2014

Fine sensorless force control using stribeck model for injection molding machine

Type: Conference Paper

Author : Iwasawa, Syu; Ohishi, Kiyoshi; Yokokura, Yuki; Miyazaki, Toshimasa; Kageyama, Koichi; Takatsu, Masaru; Urushihara, Shiro

Publisher: IEEE

Year: 2014

Highly Sensitive Magnetic Nanoparticle Imaging Using Cooled-Cu/HTS-Superconductor Pickup Coils

Type: Journal Paper

Author : Morishige, Takafumi; Mihaya, Takuro; Shi Bai; Miyazaki, Toshimasa; Yoshida, Takafumi; Matsuo, Michiaki; Enpuku, Keiji

Publisher: IEEE

Year: 2014

Author

Miyazaki, Toshimasa (5)

Ohishi, Kiyoshi (2)

Yokokura, Yuki (2)

Aoyagi, Masahiro (1)

Enpuku, Keiji (1)

Iwasawa, Syu (1)

Kageyama, Koichi (1)

Matsuo, Michiaki (1)

Mihaya, Takuro (1)

Morishige, Takafumi (1)

Publisher

IEEE (5)

Year

2014 (5)

Keywords

n Prototypes (2)

AC magnetic field measurement system (1)

ball-on-ring tests (1)

biomedical imaging (1)

Cellular networks (1)

cellular networks (1)

cellular radio (1)

Channel allocation (1)

channel allocation (1)

cooled copper Litz-wire (1)

Type

Journal Paper (3)

Conference Paper (2)

Language (ISO)

English (5)

Content Type

Metadata Only (5)

Publication Title

ecatronics (MECATRONICS), 2014 10th France-Japan/ 8th Europe-Asia Congress on (2)

Applied Superconductivity, IEEE Transactions on (1)

Components, Packaging and Manufacturing Technology, IEEE Transactions on (1)

Wireless Communications, IEEE (1)

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